英文名称 | Buffered oxide etchant (BOE) 6:1 with surfactant |
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产品介绍 |
描述 缓冲氧化物蚀刻剂(BOE)是一种用于微细加工的湿蚀刻剂。它的主要用途是蚀刻二氧化硅(SiO2)或氮化硅(Si3N4)薄膜。它是一种缓冲剂的混合物,例如氟化铵(NH4F)和氢氟酸(HF)。浓缩HF对二氧化硅的蚀刻速度太快,无法实现良好的工艺控制,并且还会剥离用于光刻图案化的光刻胶。 应用 含表面活性剂的缓冲氧化物蚀刻剂(BOE)6:1可用于去除基于AlGaN/GaN 高电子迁移率晶体管的氧化物,用于栅极光刻。也可用于缓冲氧化物蚀刻剂方法,制造微生物芯片。 Description Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO2) or silicon nitride (Si3N4). It is a mixture of a buffering agent, such as ammonium fluoride (NH4F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.Buffered oxide etchant (BOE) 6:1 with surfactant may be used in the oxide removal of AlGaN/GaN-based high electron mobility transistors for gate photolithography. It may also be used in a buffer oxide etchant method for the fabrication of micro biochip. |
¥1,399.90
¥1,399.90