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规格或纯度:
溅射靶，直径x厚度2.00英寸 ×0.25英寸 ，99.999% trace metals basis
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基本描述
| 规格或纯度 | 溅射靶，直径x厚度2.00英寸 ×0.25英寸 ，99.999% trace metals basis |
|---|---|
| 英文名称 | Silicon |
| 产品介绍 |
Application Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition |
名称和标识符
化学和物理性质
| 密度 | 2.33g/mLat 25°C (lit.) |
|---|---|
| 沸点 | 2355°C |
| 熔点 | 1410°C |
安全和危险性（GHS）
| 一般危化品 | 一般危化品 |
|---|---|
| WGK Germany | 2 |
| RTECS | VW0400000 |
| Class | 4.1 |
| 个人防护装备 | Eyeshields,Gloves,type N95 (US),type P1 (EN143) respirator filter |
产品问答
产品问答
参考文献
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