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RTM溶液C

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货号 (SKU) 包装规格 是否现货 价格 数量
R487599-1L
1L 期货 Stock Image

基本描述

英文名称 RTM solution C
产品介绍

Description

Room-Temperature nickel metallizing (RTM) process for alumina ceramics and other dielectric materials - strongly bonded nickel can be plated, soldered, brazed or welded.The RTM process is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat sinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.The RTM process is also useful for metallizing barium titanate and ferrites. In addition, many polymeric materials, notable polyesters, epoxies, cellulosics, mylar and acrylonitrile-butadiene-styrene (ABS terpolymer) may be metallized following suitable modifications of the etch (Solution A).RTM lends itself productively to the application of photolithographic technology using photo resist materials to register metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits. Base plates for building capacitor structures are also quite feasible.

Description

Room-Temperature nickel metallizing (RTM) process for alumina ceramics and other dielectric materials - strongly bonded nickel can be plated, soldered, brazed or welded.The RTM process is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat sinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.The RTM process is also useful for metallizing barium titanate and ferrites. In addition, many polymeric materials, notable polyesters, epoxies, cellulosics, mylar and acrylonitrile-butadiene-styrene (ABS terpolymer) may be metallized following suitable modifications of the etch (Solution A).RTM lends itself productively to the application of photolithographic technology using photo resist materials to register metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits. Base plates for building capacitor structures are also quite feasible.

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